We are pleased to announce that Bytronic Automation and FLIR will be co-exhibiting at Packaging Innovations 2020, located at the NEC in Birmingham, UK on February 26 & 27.

We will be demonstrating our innovative HotSpot™ solution and our engineers will be available to talk you through our complete product range in detail.

Bytronic’s flagship HotSpot product was shortlisted for 2 prestigious industry awards in 2019– for Innovative Vision Solution at the PPMA Awards and Innovation & Design at the TMMX Awards.

You can find us and check out HotSpot™ on stand H11. We hope to see you there!

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