Bytronic Admin – Bytronic

How does HotSpot work?

HotSpot is a fully integrated, 100% automated, non-contact quality control system, designed to check the integrity of hotmelt glue used in packaging. As consumers are driving the movement away from the use of plastics in packaging, cardboard is becoming a popular and sustainable alternative. Previous solutions of plastic overwrap are being replaced with both traditional..

Read more

See Bytronic at UKIVA Machine Vision Conference 2020

Join us at UKIVA’s Machine Vision Conference 2020 to hear John Dunlop talking about Artificial Intelligence in Thermal Imaging. The presentation considers the application of machine learning and artificial intelligence in the rapidly growing field of thermal imaging.  Thermal cameras are rapidly becoming an essential tool in the packaging sector – to identify quality issues..

Read more

Bytronic and FLIR are exhibiting at Packaging Innovations 2020

We are pleased to announce that Bytronic Automation and FLIR will be co-exhibiting at Packaging Innovations 2020, located at the NEC in Birmingham, UK on February 26 & 27. We will be demonstrating our innovative HotSpot™ solution and our engineers will be available to talk you through our complete product range in detail. Bytronic’s flagship HotSpot..

Read more

Season’s Greetings from Bytronic Automation!

The team here at Bytronic would like to thank customers and partners for their continued support and business in 2019. Some of our highlights in the past year include taking our flagship HotSpot product to international markets, getting shortlisted for 2 prestigious industry awards – for Innovative Vision Solution at the PPMA Awards and Innovation & Design at the TMMX..

Read more

Autodesk & MAKE UK Innovation Workshop – November 29, 2019

Bytronic Automation are pleased to host the upcoming innovation workshop with MAKE UK and Autodesk on November 29, 2019 at our Innovation Campus offices in Birmingham, UK. Autodesk have a slogan “READY TO MAKE ANYTHING”, something we at Bytronic definitely identify with. The Bytronic engineering teams are tasked very early on to participate and design..

Read more

Bytronic will be exhibiting at FachPack 2019 from 24-26 September 2019

FachPack is one of the most important European packaging exhibitions. Whether you’re looking for packaging materials and supplies, packaging machines, labelling and marking equipment, packaging processing or packaging logistics – the trade fair’s product range leaves nothing to be desired. Bytronic Automation will be exhibiting from 24-26 September 2019 at FachPack in Hall 2 /..

Read more

Bytronic Automation Nominated at PPMA Group Industry Awards 2019

The PPMA Group Industry Awards recognises the finest examples of innovation, smart manufacturing, entrepreneurship and collaboration in the processing and packaging machinery industry’s prestigious annual awards ceremony. We are happy to announce that Bytronic Automation have been shortlisted for the Innovative Vision Solution award, which is sponsored by UKIVA. The winners will be announced at..

Read more